I spent two days touring Intel’s most advanced fab and talking to its technical leadership to understand what the chips of the future will look like. A lot of what's coming next – gate-all-around transistors, backside power, CFET, hybrid bonding – is hard to follow without actually seeing it, so we made all the awesome animated explainers that I wish I had while I was prepping. I also asked Intel’s leadership how the semiconductor industry will cope with the enormous shock in demand from AI. AI compute has grown 3x a year for the last...
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To sustain that progress, foundries like Intel will need to manufacture far more leading-edge
, .
The production of these chips is bottlenecked by tools
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B2 · 中高级
能看懂电视新闻就会觉得轻松
- 83% 的单词在 B1 或更简单的水平。
- 每分钟 180 词:自然语速,偏快。
- 整集共有 361 个较难的单词(B2 及以上)。
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There's never been as big a shock to the semiconductor industry as the current surge in demand from AI. AI is driving incredible computing demand. Easily 40 to 50% above our maximum capacity, which I've never seen before.
Progress in AI has been driven by exponentially increasing compute. To sustain that progress, foundries like Intel will need to manufacture far more leading-edge compute, both by producing more chips and by improving what each chip can do. The production of these chips is bottlenecked by tools
that Intel buys from their suppliers, most famously, ASML's EUV machines. If they don't have the equipment, they can't make the chips here.
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